Rupes UHS Polishing Foam Pad expanded resin foam polishing pads are specially designed for the random orbital polishing system. They produce excellent results with substantial time saving and reduced compound consumption. Particular structure guarantees maximum efficiency in the polishing process with minimum downward vertical pressure from the operator. The center hole creates superior ventilation and heat dispersion through special channels in the backing pad. The innovative design of the truncated cone shape optimizes the performance of the large diameter orbit, and at the same time protects against accidental contact between the backing pad and the work surface.